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Fabrication of Printed Circuit Boards

IP.com Disclosure Number: IPCOM000052318D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Fey, ED Maier, LR Summa, WJ [+details]

Abstract

Printed circuit boards can be fabricated by the following technique: 1. Partially cured adhesive is applied to epoxy glass laminates by the usual techniques, such as transfer from a coated plastic film, dip coating, spray coating, etc. 2. The adhesive and the epoxy glass are cured by laminating under pressure and heat. 3. The cured adhesive surface is modified by a conventional wet chemical process (such as alkaline permanganate or chrome/sulfuric, etc.) or by plasma techniques to achieve acceptable adhesion of a seeder, photoresist and electrolessly deposited metal. 4. Photoresist is applied, exposed, and developed. 5. Electroless copper is plated. 6. The photoresist is removed.