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Electroless Palladium Depositing Solution and Pad On Pad Contacts Utilizing Electroless Palladium Film

IP.com Disclosure Number: IPCOM000052319D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Armstrong, EJ [+details]

Abstract

Dendrites are generally very fragile and, when used on pad-on-pad connectors, are easily broken and smashed. To overcome this weakness, the plated contact pads can be immersed in a palladium solution containing 160 g/1 ammonium formate; 3.2 g/1 palladium (Pd/++/) as metal, and 2.4 g/1 chlorine (C1) as ammonium chloride. The palladium deposits selectively on the dendrites and builds up around the base and on the sides, making them substantially stronger and smoother. The deposition rate is proportioned to time and temperature. Pad-on-pad contacts prepared by this method are capable of withstanding several matings without apparent damage.