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The use of a high thermal conducting heat spreader in thermal grease, a shown above, increases the thermal conductivity of the structure.
English (United States)
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Heat Spreader With Thermal Grease
The use of a high thermal conducting heat spreader in thermal grease, a
shown above, increases the thermal conductivity of the structure.
Integrated circuit chip 1 is mounted on pinned substrate 8. It is desired to
conduct heat from the integrated circuit chip 1 to the module cover 2. The heat-
conducting path is through thermal grease 6, heat spreader 5 and thermal grease 7.
The heat spreader 5 is made of a high thermal conductive material, such as
copper or aluminum.
Heat generated in the chip 1 spreads and conducts to the module cover 2
through the thin film of grease 6, heat spreader 5 and thicker upper grease film 7.
The lower grease film is so thin that the thermal resistance is almost negligible.
Because of the high thermal conductivity of the spreader material, its thermal
resistance is very low. Therefore, the major contributor to the overall thermal
resistance of this path is the upper grease film. However, its thermal resistance
is lower than it would be without the heat spreader because of the relatively large
heat-conducting area which is defined by the spreader. Thus, the module
internal thermal resistance is substantially reduced without lessening the overall
net grease film thickness.
The module internal thermal resistance is mainly dependent on the heat
spreader size, therefore, the spreader size can be tailored to meet the internal
thermal resistance requirements of the module. However, for the best thermal