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Pneumatic Chuck Transfer System

IP.com Disclosure Number: IPCOM000052334D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Cachon, RP [+details]

Abstract

A pneumatic chuck transfer system for semiconductor wafers includes two wafer-holding chucks 1 and 2. The chucks are attached to a rotatable shaft 3 by arms 4 and 5, respectively. Shaft 3 is rotated to bring either chuck to a wafer load and unload position while the other chuck is moved into position for processing a semiconductor wafer such as to expose a layer of photoresist coated on the wafer. Pinion 6 is attached to shaft 3 and is rotated by moving rack 7. The reciprocal movement of rack 7 is accomplished using two air cylinders 8 and 9. Chamber B of cylinder 8 is connected to chamber B of cylinder 9 with a fix restrictor 10 in between. Air pressure to the cylinder chambers to cause reciprocation of rack 7 is controlled by electrically activated pneumatic valves 11 and 12.