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Semiconductor Module and Method of Fabrication Using Transverse Via Technology

IP.com Disclosure Number: IPCOM000052336D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Dougherty, WE Greer, SE [+details]

Abstract

A substrate can be fabricated that conforms to the teachings of U.S. Patents 4,193,082 and 4,202,007 by the following process sequence. . Start with what is commonly referred to as ceramic "green sheet" or tape. . The green sheet may vary in thickness from .0005 to .050 in .0005 increments depending on the needs of the final structure. . On this sheet a pattern is screened using a suitable metal or emulsion mask and a conductor paste consisting of a solvent, glass frit, binder, and refractory metal, such as tungsten or molybdenum. This will result in a conductor that will provide electrical continuity in the finished module from one or more of the following: . front to back . front to front . back to back . front to side . back to side . side to side .