Browse Prior Art Database

High Performance Single Chip Module

IP.com Disclosure Number: IPCOM000052338D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Cavaliere, JR Feinberg, I Platt, A [+details]

Abstract

A back-bonded chip-interposer packaging scheme is described which circumvents the circuit density and power distribution limitations of previous back-bonded chip packages.