Browse Prior Art Database

High Efficiency Module Cover

IP.com Disclosure Number: IPCOM000052360D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Falda, A [+details]

Abstract

Parallel piped-shaped metal top covers are currently used in the semiconductor industry as standard packaging. A modified shape for this kind of cover is proposed hereunder. The above design: - increases the ventilation around the module and hence increases the power dissipation, and - decreases the heating of the chip, hence improves the speed of the circuits.