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High Efficiency Module Cover Disclosure Number: IPCOM000052360D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

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Falda, A [+details]


Parallel piped-shaped metal top covers are currently used in the semiconductor industry as standard packaging. A modified shape for this kind of cover is proposed hereunder. The above design: - increases the ventilation around the module and hence increases the power dissipation, and - decreases the heating of the chip, hence improves the speed of the circuits.