Double Pass Screening
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
One of the steps in plasma panel fabrication involves the application a thick film dielectric over a conductor array on a pair of glass substrates using a screening process. However, on large substrates, the screening process produced problems in the form of pinholes and voids in the dielectric. This problem was resolved by converting to a two-pass screening operation during which one-half the required amount of dielectric paste was deposited on each pass. While this solved the pinhole problem, it required a drying cycle for the substrates between passes. The additional handling and time required to perform these extra operations was significant.