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Vapor Phase Chip Carrier Removal

IP.com Disclosure Number: IPCOM000052397D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
DeBoskey, WR [+details]

Abstract

Vapor-phase condensation soldering is a well-known process for joining components to printed circuit cards or boards. A direct joining of integrated circuits or leadless chip carriers may similarly be employed. During rework of defective modules, cards or boards, it is often necessary to unsolder the bonded chip carrier or integrated circuit package from the carrier. Vapor-phase desoldering can be used to avoid disadvantages associated with the more common solder removal methods, such as hot gas jets, micro flames, infrared heating, and the like. However, the hostile hot vapor environment of the vapor-phase soldering/desoldering process precludes many of the more obvious techniques for gripping and removing the part to be joined/unjoined once the solder joint has been liquified.