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Demounting Mechanism for Sputter Deposited Substrates

IP.com Disclosure Number: IPCOM000052413D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Chiang, KR McCarey, WE [+details]

Abstract

To minimize damage of gallium/indium-backed substrates when they are removed from a substrate-holder platen following sputter deposition, a demounting mechanism is employed.