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To minimize damage of gallium/indium-backed substrates when they are removed from a substrate-holder platen following sputter deposition, a demounting mechanism is employed.
English (United States)
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Demounting Mechanism for Sputter Deposited Substrates
To minimize damage of gallium/indium-backed substrates when they are
removed from a substrate-holder platen following sputter deposition, a
demounting mechanism is employed.
Prior to the sputter deposition process, the gallium/indium-backed ferrite
substrates 1 are positioned above two closely spaced holes in the platen. After
the sputter deposition, the substrate-holder platen 2 is removed and placed on
the demounting block 3. The demounting block is designed so that pins 4 can be
inserted through the holes beneath each ferrite substrate on the platen. The
narrow edge of the rectangular substrate is lifted from the surface of the platen
by the inserted pins. In this way, the substrates are separated and removed from
the platen without damage.
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