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Browse Prior Art Database

Heat Sink for Electronic Device

IP.com Disclosure Number: IPCOM000052429D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Moth, FT [+details]

Abstract

An electronic device, such as a silicon chip, is cooled by means of a low boiling point liquid, such as FREONT, in a recirculatory system. Heat from the device is absorbed by the FREON in a cooling coil, causing it to boil and flow to a condenser coil in a cooler environment. Liquid FREON returns to the cooling coil. The degree of cooling is controlled by means of a heater which preboils the FREON returning to the cooling coil. Preferably, the device to be cooled is mounted on a plate which carries the cooling coil, and the condenser coil is carried by a conducting plate. * Trademark of E. I. du Pont de Nemours & Co.