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Method for Selective Plating and Etching Using Resistive Heating

IP.com Disclosure Number: IPCOM000052436D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

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Related People

Melcher, RL Shiren, NS [+details]


A method is described which makes possible the selective plating and/o etching of metal lines on chips, cards, boards and ceramics. Uses are foreseen in the personalization and repair of chips and packages for electronic circuitry. The method makes use of the existence of relatively high resistance segments of otherwise highly conducting lines. An electric current locally heats the high resistance segments causing greatly enhanced plating rates.