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Here, localized maskless plating and simultaneous isolation of metal patterns does not require reducing agents, an external EMF source, or that the plated metal be more noble than the substrate.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
78% of the total text.
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Laser Enhanced Plating Without Reducing Agent or External EMF Source
Here, localized maskless plating and simultaneous isolation of metal
patterns does not require reducing agents, an external EMF source, or that the
plated metal be more noble than the substrate.
By exposing a metallic substrate to a laser beam with the substrate
submerged in a solution of its ions, a local metal deposition occurs in the region
of absorption of the laser. This is due to a shift of the equilibrium potential of the
system Me/Me/z+/ at the hotter region to a more positive value. Thus, the
system is a small local thermo-battery. The heated region acts as a cathode (i.e.,
is the location of a deposition reaction) and the cold part is an anode (i.e.,
dissolves). For instance, using a Cu substrate in a CuSO(4) 0.05M/H(2)SO(4)1M
solution at an incident laser power density of 600 w/cm/2/, the edges of the
plated copper spot were very sharp and the plated region was insulated from the
surface because of the dissolution of an annulus around the spot. This process
has the combined advantage of plating while simultaneously isolating the deposit
from its immediate vicinity. Therefore, it is useful in plating lines for applications
such as pattern fabrication.
When the equilibrium potential of the hotter region is shifted to a more
positive value, one may achieve deposition of ions from a less noble metal than
the substrate if the equilibrium potentials of the two systems Me(1)/Me(1) /z/2/+/