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Laser Enhanced Plating Without Reducing Agent or External EMF Source

IP.com Disclosure Number: IPCOM000052438D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Acosta, RE Puippe, JC von Gutfeld, RJ [+details]

Abstract

Here, localized maskless plating and simultaneous isolation of metal patterns does not require reducing agents, an external EMF source, or that the plated metal be more noble than the substrate.