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Laser Enhanced Plating Without Reducing Agent or External EMF Source

IP.com Disclosure Number: IPCOM000052438D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

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Acosta, RE Puippe, JC von Gutfeld, RJ [+details]


Here, localized maskless plating and simultaneous isolation of metal patterns does not require reducing agents, an external EMF source, or that the plated metal be more noble than the substrate.