Tungsten Source Quality and Intensity Monitoring System for Individual Chip Joining Tool
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
An individual chip-joining tool employs a tungsten lamp as the heat source to heat solder balls for chip joining. The output of the lamp varies. If the lamp output drops too low, the temperature at the chip drops for a fixed voltage setting. The result can be a solder ball joint having less than optimum electrical characteristics.