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Tungsten Source Quality and Intensity Monitoring System for Individual Chip Joining Tool

IP.com Disclosure Number: IPCOM000052442D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Tan, SI [+details]

Abstract

An individual chip-joining tool employs a tungsten lamp as the heat source to heat solder balls for chip joining. The output of the lamp varies. If the lamp output drops too low, the temperature at the chip drops for a fixed voltage setting. The result can be a solder ball joint having less than optimum electrical characteristics.