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In Process Inspection With E Beam

IP.com Disclosure Number: IPCOM000052518D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Moore, RD [+details]

Abstract

Today, in-process inspection of semiconductor wafers is accomplished, for the most part, with optical inspection by skilled operators. Using a microscope, the operator scans the chip sites of a selected test wafer to determine its acceptability. Unacceptable conditions include: 1. High deflect level. 2. Missing process steps. 3. Gross dimensional inaccuracies.