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Process for Low Contact Resistance Shallow Junction Structures with Good Junction Integrity Disclosure Number: IPCOM000052521D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

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Howard, JK [+details]


Described here is an approach to improve thermal stability of Al or Al Cu/Ti contact to Approximately > 500 Degrees C yielding low contact resistance a penetration.