Browse Prior Art Database

Process for Low Contact Resistance Shallow Junction Structures with Good Junction Integrity

IP.com Disclosure Number: IPCOM000052521D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Howard, JK [+details]

Abstract

Described here is an approach to improve thermal stability of Al or Al Cu/Ti contact to Approximately > 500 Degrees C yielding low contact resistance a penetration.