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Chemical Etching of Silicon Wafer Rim

IP.com Disclosure Number: IPCOM000052532D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Cazcarra, V Garroux, D [+details]

Abstract

As the wafer diameter increases, defects starting at the edges of wafer such as slip lines, become more and more critical. In order to optimize this parameter, a mechanical chamfering operation was previously described [*]. This technique provides a rounded edge which solves the edge-chipping problem. However, in some cases residual damage may still remain that can cause the generation of slip lines.