Technique for Developing Multiple Test Points Using a Single Input Gate
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
With the advent of large-scale integration (LSI) technologies, an incre quantity of logic may be packaged at the first level. The logic package must be tested when it is manufactured. The increased testing problem for sequential logic may be reduced if it is properly considered during the design phase.