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Evaporation of Stress Free Films

IP.com Disclosure Number: IPCOM000052652D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Kircher, CJ Wu, CT [+details]

Abstract

Metallic films of Nb and other elements generally exhibit tensile stres when deposited by evaporation. The presence of these stresses often causes damage to underlying resist layers which are used to pattern the films by stencil lift-off techniques. An improved deposition process is described for providing these metal films with reduced intrinsic stress. During evaporation of the metallic film, low energy ion bombardment occurs using argon ions.