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Browse Prior Art Database

Tile Circuit Package

IP.com Disclosure Number: IPCOM000052654D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Herrell, DJ [+details]

Abstract

Many circuit packages suffer from yield problems if they are made with high chip wire density. However, such density is needed to keep the circuit chips close together and to give sufficient wirability to the package. In order to achieve both of these requirements, a "tile" package is proposed in which the package is mechanically large and has a minimum amount of personality; it is made to be only a "space transformer". Wiring modules are utilized to perform the interconnections between circuit chips, the personality being given to the wiring chips and to the active circuit chips.