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Self Gettering Capsule Diffusion Furnace

IP.com Disclosure Number: IPCOM000052694D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Beaufrere, P Pulaski, DP [+details]

Abstract

During diffusion processing of semiconductor wafers in a capsule, to minimize or eliminate metallic contamination traceable to the capsule material, the seal-off mechanism or the furnace used to heat the capsule, the capsule is placed into a tube or furnace which can be pumped down to a pressure lower than that inside the capsule. In such an arrangement, contaminant diffusion is favored in a direction away from the interior of the capsule.