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This article describes an improved mounting device for silicon chip modules which is easy to apply and remove, thereby facilitating the reworking of modules.
English (United States)
This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
98% of the total text.
Page 1 of 2
Removable/Reusable Cap for Modules
This article describes an improved mounting device for silicon chip modules
which is easy to apply and remove, thereby facilitating the reworking of modules.
The improved mounting device is a unitary molded elastomeric material
which is adapted to resiliently encompass a substrate having one or more silicon
chips mounted thereon, and also to resiliently encompass a cover member.
As seen in Fig. 1, the device shown in partial transverse section and
designated by the reference character 10 is generally rectilinear in shape and is
molded of a sealable elastomeric material, such as a silicone elastomer. The
device has formed therein a rectilinear module-receiving groove 12 and a
narrower rectilinear cap-receiving groove 14. An opening 16 in one face of the
device communicates with the groove 12, and an opening 18 in the other face
communicates with the groove 14.
The device can be applied to a substrate and to a cover much as a grommet
is applied. The device, as applied, is shown in partial cross section in Fig. 2. As
can be seen in this figure, the device fits snuggly around the substrate 20 and
around the cap 22. The device in many instances provides all the sealing
necessary to protect the device and exclude ambient atmosphere. The metal
cap 22 provides good heat transfer characteristics and can be marked for module
This structure makes removal and rework of the module quite easy.