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Method of Attaching Pins and Substrates

IP.com Disclosure Number: IPCOM000052698D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Phelps, DW Slattery, WJ Ward, WC [+details]

Abstract

One of the difficulties encountered in obtaining an effective, reliable pin structure on a substrate of a module is that of forming an effective, reliable connection between the pins and the vias on the substrate. Brazing and soldering have been the most utilized techniques, but these are more prone to failure, due to insufficient bond strength, than pins attached by welding. However, welding has not proved effective in attaching pins to vias due to cracking of the substrate due to thermal stresses. This article describes an improved module pin structure and technique for forming such structure.