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Browse Prior Art Database

Conduction Cooled Module

IP.com Disclosure Number: IPCOM000052699D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Audi, RD [+details]

Abstract

An improved assembly and method of use thereof for improving thermal conduction from semiconductor chips to the caps of modules is described.