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Module Process Compatible Thermally Enhanced Fin Attach Process

IP.com Disclosure Number: IPCOM000052700D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue


Related People

Buller, ML Susko, JR Ward, WC Wheater, RH [+details]


An improved adhesive material to attach a heat sink to the cap of a semiconductor module is disclosed.