Browse Prior Art Database

Module Process Compatible Thermally Enhanced Fin Attach Process

IP.com Disclosure Number: IPCOM000052700D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Buller, ML Susko, JR Ward, WC Wheater, RH [+details]

Abstract

An improved adhesive material to attach a heat sink to the cap of a semiconductor module is disclosed.