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An improved adhesive material to attach a heat sink to the cap of a semiconductor module is disclosed.
English (United States)
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Module Process Compatible Thermally Enhanced Fin Attach Process
An improved adhesive material to attach a heat sink to the cap of a
semiconductor module is disclosed.
The adhesive material is comprised of an epoxy, a curing agent for the
epoxy, and boron nitride as a filler. Preferably, the material should be about 45%
to about 55% by weight of a diglycidyl ether of bisphenol A having an epoxy
equivalent weight of about 600 to about 700, about 15% to about 25% by weight
of an anhydride curing agent, and from about 20% to about 40% by weight of the
boron nitride. The epoxy and curing agent provide the bond strength, and the
boron nitride provides good heat conduction from the cap to the heat sink.