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Solder Preform With Fusion Temperature Gradient

IP.com Disclosure Number: IPCOM000052744D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Lloyd, JR Singh, P [+details]

Abstract

A solder preform is constructed to have a fusion temperature gradient. The preform is placed between surfaces of two subjects that are to be bonded and the solder and adjacent regions of the two subjects are heated, as is conventional. As the temperature of the solder preform rises, melting begins at the low temperature edge of the gradient. As the temperature rises further, melting proceeds in the direction of the gradient. This operation provides improved contact between the solder and the surfaces that are to be bonded.