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Step Coverage During Thin Film Deposition

IP.com Disclosure Number: IPCOM000052806D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11

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Cuomo, JJ Gegenwarth, RE Harper, JME Proto, GR [+details]


A method is desirable for improving step coverage of a thin film during thin film deposition. The method involves simultaneously bombarding the growing film during deposition by a directed ion beam of controlled ion energy and current density. The ion beam causes a partial resputtering of the coating material which redistributes the material sideways and thereby eliminates the formation of a step edge crack.