Browse Prior Art Database

Single Exposure Planar Bubble Devices

IP.com Disclosure Number: IPCOM000052827D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Hofer, DC Powers, JV Pugh, EW [+details]

Abstract

A process is described for fabricating planarized field-access bubble devices using a single lithographic exposure to define both the magnetic elements and the conductor control lines. The bubble chip functions of storage, propagation, switching, replication, and generation can be performed by structures having cross sections, represented in Fig. 4. It will be noted that the permalloy 28 in Fig. 4 is shown with the same width as the underlying gold structure 24. However, it may be narrower than the gold structure, or nonexistent on the gold structure. These three general structural forms are accomplished by means of the process steps depicted in Figs. 1, 2 and 3.