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Pin Attachment Technique and Structure

IP.com Disclosure Number: IPCOM000052865D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Phelps, DW Samuelson, S Ward, WC [+details]

Abstract

In the attachment of pins to ceramic or plastic substrates on which silicon chips are mounted, it is necessary to obtain a good, reliable, strong bond of the pins to the top surface metallization or to metal-filled vias. This article describes an improved technique and resulting structure which minimizes failures of pin attachment due to substrate cracking and maximizes the strength and reliability of pin attachments to a substrate.