Browse Prior Art Database

Chip Conversion

IP.com Disclosure Number: IPCOM000052867D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Ward, WC [+details]

Abstract

There are two basic techniques for mounting semiconductor chips on substrates. One technique is the so-called wire bonding which utilizes wire leaders from the face of the chip, and the other is the so-called flip-chip bonding wherein pads of metal are evaporated onto the face of the chip. Most of the manufacturers making wire-bonded chip are not equipped for providing pads on chips for flip-chip bonding, but it is often desirable to connect wire-bonded chips by flip-chip-bonding methods. For various reasons it is often not practical or possible to purchase a wafer and convert the whole uncut wafer to flip-chip-bonded pads and it is not economically feasible or practical to convert an individual chip from wire-bonded to flip-chip-bonded connections.