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Chip Removal and Chip Site Dressing

IP.com Disclosure Number: IPCOM000052907D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
McNutt, RD Schink, K [+details]

Abstract

Semiconductor frontside bonded chip removal and chip site dressing techniques have usually used heat in some form to separate the chip from the substrate and dress-clean the chip site for further chip placement. This has created major problems of metallurgical degradation of solder joints and substrate contamination.