Chip Removal and Chip Site Dressing
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11
Semiconductor frontside bonded chip removal and chip site dressing techniques have usually used heat in some form to separate the chip from the substrate and dress-clean the chip site for further chip placement. This has created major problems of metallurgical degradation of solder joints and substrate contamination.