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Microsystem Package for Chips Disclosure Number: IPCOM000053061D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

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Archey, WB Nestork, WJ Olsen, RF Slattery, WJ [+details]


As memory and processing chips become denser, it becomes feasible to provide a complete system on a single substrate. This article describes a technique for providing one or more memory chips together with one or more processor chips on a single substrate, with mounting sites able to accommodate either memory or processor chips, and also a technique for interconnecting several systems.