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This article describes a retarding mechanism for decelerating sliding, fragile semiconductor wafers, which reduces or eliminates wafer breakage and chipping.
English (United States)
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100% of the total text.
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Semiconductor Wafer Decelerator
This article describes a retarding mechanism for decelerating sliding, fragile
semiconductor wafers, which reduces or eliminates wafer breakage and
Wafers 10 are often fed, under the force of gravity, such as a slide 11, onto
various tool supports 12 where they can then be handled or otherwise treated.
Presently, such wafers are stopped by impacting against rigid stops which can
cause breakage or chipping of the edges of the device which can cause severe
problems. The improved retarding mechanism 13, shown herein, consists of a
center support strip 14 carrying at one end a double-ended, cantilever spring 15
which has its ends 16 bent to apply a retarding force upon the edges of the
wafers being received by the support 12.
Strip 14 is mounted over the support 12 and further has a positive spring stop
17 attached to its end such that when the wafer 10 slides beneath the cantilever
spring ends 16 where it is drastically slowed without sudden jarring or impacting,
it finally rests against the positive spring stop 17. This cantilever spring
mechanism can be mechanically actuated to permit the wafer 10 to be raised or
otherwise removed from the unit after complete stoppage has been achieved.
Breakage of wafers, using this spring-retarding mechanism, have been reduced
25%, thus achieving significant savings.
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