Browse Prior Art Database

Method for Making Reliable Multiwire Plated Through Holes

IP.com Disclosure Number: IPCOM000053076D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Underkofler, WL Vlasak, GP [+details]

Abstract

In the multiwire circuit board process, insulated copper wires are embedded in an adhesive layer by a wiring machine. A layer of epoxy glass prepreg is hot pressed over the wires and adhesive to encapsulate the wires. Electrical connections to the wires are made by drilling through the board and wires and making a plated through hole with plated connection to the end of the wire. The plated through hole is made by catalytically seeding the hole wall followed by electroless copper plating.