Browse Prior Art Database

Wire Bonding Adhesive for Multiwire Circuit Boards

IP.com Disclosure Number: IPCOM000053078D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Alpaugh, WA Matolka, W Underkofler, WL [+details]

Abstract

In the multiwire circuit board process, insulated copper wires are embedded in an adhesive layer by a wiring machine. A layer of epoxy glass pre-preg is hot pressed over the wires and adhesive to encapsulate the wires. Electrical connections to the wires are made by drilling through the board and wires and making a plated through hole with plated connection to the end of the wire. The plated through hole is made by catalytically seeding the hole wall followed by electroless copper plating.