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Wire Bonding Adhesive for Multiwire Circuit Boards Disclosure Number: IPCOM000053078D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue


Related People

Alpaugh, WA Matolka, W Underkofler, WL [+details]


In the multiwire circuit board process, insulated copper wires are embedded in an adhesive layer by a wiring machine. A layer of epoxy glass pre-preg is hot pressed over the wires and adhesive to encapsulate the wires. Electrical connections to the wires are made by drilling through the board and wires and making a plated through hole with plated connection to the end of the wire. The plated through hole is made by catalytically seeding the hole wall followed by electroless copper plating.