Wire Bonding Adhesive for Multiwire Circuit Boards
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12
In the multiwire circuit board process, insulated copper wires are embedded in an adhesive layer by a wiring machine. A layer of epoxy glass pre-preg is hot pressed over the wires and adhesive to encapsulate the wires. Electrical connections to the wires are made by drilling through the board and wires and making a plated through hole with plated connection to the end of the wire. The plated through hole is made by catalytically seeding the hole wall followed by electroless copper plating.