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EC Wiring Plane Design

IP.com Disclosure Number: IPCOM000053080D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Kopl, TG Williams, GL [+details]

Abstract

A design is provided for the surface pattern on the wiring side of a printed circuit board wherein PTH lands and signal pads and ground pads are symmetrically arranged across the board, as shown. The lands and pads are surrounded by a photosensitive dielectric material which has windows which overlie the lands and pads. This creates wells which improves the application of solder to the lands and pads and improves the bonding of twisted pair wires, which are used for overflow wiring on the board that cannot be made internally and also to make engineering changes and repair shorts and opens.