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Method to Control the Reliability of Ion Etched Vias

IP.com Disclosure Number: IPCOM000053101D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Rathore, HS [+details]

Abstract

The reliability of reactive ion etched (RIE) vias depends on the via slope and the amount of metal deposition along the slope. Up to now, the monitoring of this metal required the use of a scanning electron microscope (SEM). It is proposed to control RIE via reliability electrically by monitoring whether the via resistance lies within a predetermined tolerance range. A practical arrangement comprises, for instance, a 1200 via chain with a total resistance value of < or = 120 Omega to assure good reliability properties.