Browse Prior Art Database

Technique for Eliminating Backside Contamination During Wafer Processing/ Characterization

IP.com Disclosure Number: IPCOM000053108D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Conner, TF Pistor, RL Sheldon, HS [+details]

Abstract

To eliminate contamination introduced by the wafer chuck or holder during wafer processing and characterization, this article proposes the use of a silicon wafer as a barrier between the wafer chuck and the device wafer.