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Technique for Eliminating Backside Contamination During Wafer Processing/ Characterization Disclosure Number: IPCOM000053108D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

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Conner, TF Pistor, RL Sheldon, HS [+details]


To eliminate contamination introduced by the wafer chuck or holder during wafer processing and characterization, this article proposes the use of a silicon wafer as a barrier between the wafer chuck and the device wafer.