Browse Prior Art Database

Direct Sealed Multi-chip Module

IP.com Disclosure Number: IPCOM000053111D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Lipschutz, LD [+details]

Abstract

This is a proposal for an improved configuration for mounting modules, such as the IBM Thermo Conduction Module (TCM), in a cooling hat. In a TCM, the chips on a multilayer ceramic carrier are hermetically sealed by a cooling hat which carries pistons contacting each chip. The seal, as disclosed here, is effected by a lead plated steel C ring which is compressed between a ground border on the ceramic substrate and the aluminum hat. To reduce localized stresses imposed by the clamping plate on the pin side of the substrate, a thin lead gasket is used as a cushion.