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A thin film magnetic head assembly is formed with the read and write elements in a side-by-side configuration, deposited on a substrate. The read transducing gap is made thinner than the write gap.
English (United States)
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Thin Film Magnetic Head Assembly
A thin film magnetic head assembly is formed with the read and write
elements in a side-by-side configuration, deposited on a substrate. The read
transducing gap is made thinner than the write gap.
A method for making such side-by-side configuration employs a lift off
process in which a thin insulator layer, forming the thin transducing gap for the
read element, is sputtered onto the wafer, after the P1 layers of the read element
and write element have been deposited (Fig. 1). A resist 2 is applied over the
insulator gap layer 1 across the wafer, and the mask is exposed and developed
so that the resist remains only on top of the read element, as illustrated in Fig. 2.
A layer 3 of Al(2)O(3) is sputtered over the entire wafer for forming the
transducing gap, as shown in Fig. 3. The resist over the read element portion
only is removed with the sputtered Al(2)O(3), so that a structure such as depicted
in Fig. 4 results. Thus, the transducing gap layer of Al(2)O(3) over the read
element is relatively thin, about 0.4 mu m, whereas that for the write element is
much thicker, about 1.0 mu m.
Another acceptable sequence of lift-off process is to lift-off the first Al(2)O(3)
layer rather than the second layer. In this case, the first layer would be equal to
the difference in gap thickness, and the second layer would equal the read gap
An alternative method, for providing different gap thicknesses for the read
and write elements...