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Thin Film Magnetic Head Assembly

IP.com Disclosure Number: IPCOM000053169D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Barlow, M Church, MA Jones, RE Yeh, TH [+details]

Abstract

A thin film magnetic head assembly is formed with the read and write elements in a side-by-side configuration, deposited on a substrate. The read transducing gap is made thinner than the write gap.