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Flip Chip Bonded Ground Plane for Ceramic Chip Carriers

IP.com Disclosure Number: IPCOM000053201D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Comerford, LD [+details]

Abstract

A ground plane may be attached to a ceramic chip carrier in close proximity to conducting lines to improve high frequency isolation between conducting lines.