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A ground plane may be attached to a ceramic chip carrier in close proximity to conducting lines to improve high frequency isolation between conducting lines.
English (United States)
This text was extracted from a PDF file.
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This is the abbreviated version, containing approximately
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Flip Chip Bonded Ground Plane for Ceramic Chip Carriers
A ground plane may be attached to a ceramic chip carrier in close proximity
to conducting lines to improve high frequency isolation between conducting lines.
Referring now to Fig. 1, an attachable ground plane 10 may be made from a
thin, two-sided, metallized, dielectric material 12, such as KAPTON* or MYLAR*.
The metallization must be of a kind which is readily wettable by solder. In order
to use such a film, the metallization 14 on one side of the film 12 must be
delineated into a pattern which is the mirror image of the conducting lines 16 on
the chip carrier 18. This metallization should be tinned (15). Screened-on solder
paste may be used. Holes 20 must also be punched through the film so that the
IC chip 22 (attached via solder 24 to conducting lines 16) and other
protuberances (such as contact pins 26) on the carrier surface do not prevent the
film from coming into intimate contact with the conducting lines.
After the film is prepared, it may be attached to the populated
chip carrier by registering the metallization pattern on the film to
the pattern on the chip carrier and heating the carrier to the
melting point of the solder. If the heat is applied so that the
center of the module reaches the solder melting point first, and the
melt proceeds outward from the center, then the film will be pulled
down to the carrier by the surface tension of the liquid solder (Fig.
2). The radial spread of the melt i...