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Mixed Technology Stacked Module Disclosure Number: IPCOM000053263D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

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Armant, RG DiPietro, M Williams, WF [+details]


Increased circuit density can be obtained by stacking pretested 1" and 1/2' modules on a larger ceramic substrate using existing reflow techniques and processing. Wirability surfaces on four layers of ceramic can be used for interconnections of the stacked modules.