Browse Prior Art Database

Mixed Technology Stacked Module

IP.com Disclosure Number: IPCOM000053263D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Armant, RG DiPietro, M Williams, WF [+details]

Abstract

Increased circuit density can be obtained by stacking pretested 1" and 1/2' modules on a larger ceramic substrate using existing reflow techniques and processing. Wirability surfaces on four layers of ceramic can be used for interconnections of the stacked modules.