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Copper/Cermet Bond

IP.com Disclosure Number: IPCOM000053269D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Nair, KK Rasile, J Smey, SL [+details]

Abstract

To enhance the adhesion of copper to cermet, the copper is initially deposited, e.g., by evaporation, at a controlled rate which is slower than the rate used for the remainder of the deposition process.