Browse Prior Art Database

Copper/Cermet Bond Disclosure Number: IPCOM000053269D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue


Related People

Nair, KK Rasile, J Smey, SL [+details]


To enhance the adhesion of copper to cermet, the copper is initially deposited, e.g., by evaporation, at a controlled rate which is slower than the rate used for the remainder of the deposition process.