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To enhance the adhesion of copper to cermet, the copper is initially deposited, e.g., by evaporation, at a controlled rate which is slower than the rate used for the remainder of the deposition process.
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To enhance the adhesion of copper to cermet, the copper is initially
deposited, e.g., by evaporation, at a controlled rate which is slower than the rate
used for the remainder of the deposition process.
Typical parameters for depositing an 80,000-angstrom Cu layer onto cermet
are as follows: (1) an initial deposition rate of 8 to 10 angstroms/sec. for
approximately the first 1,000 angstroms, (2) followed by a deposition rate of 150
to 250 angstroms/sec. for the remainder, i.e., 79,000 angstroms.
Conventional processes are subsequently used to personalize the
metallurgy, which may include a protective Cr layer deposited on the Cu. This
system is particularly useful for making cermet resistors on metallized ceramic