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Process for Improving Ball Limiting Metallurgy Disclosure Number: IPCOM000053273D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

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Boyar, S Chiu, GT [+details]


High via resistance of ball-limiting metallurgy, resulting from the use of polyimide insulating layers is lowered by a 0(2) plasma ash and a HF dip clean either before or after polyimide film curing.