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Thermal Characteristics of Semiconductor Chip Module Packages

IP.com Disclosure Number: IPCOM000053290D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Kaufman, CL Kiesling, DA [+details]

Abstract

Background Thermal characteristics of module packages are a key design parameter in the final design of semiconductor chip module packages. Engineering studies which evaluate the thermal characteristics of the chip or module packages and their associated interconnection reliability have become an integral part of the design cycle.