Browse Prior Art Database

Dispense Template For Multi-Chip Modules

IP.com Disclosure Number: IPCOM000053397D
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Kotrch, GS [+details]

Abstract

The arrangement shown in the drawing enables a number of pads of thermal compound to be deposited at various predetermined locations onto the bottom of an inverted circuit module cap.