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The arrangement shown in the drawing enables a number of pads of thermal compound to be deposited at various predetermined locations onto the bottom of an inverted circuit module cap.
English (United States)
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Dispense Template For Multi-Chip Modules
The arrangement shown in the drawing enables a number of pads of thermal
compound to be deposited at various predetermined locations onto the bottom of
an inverted circuit module cap.
The cap 1 is placed in a cavity 2 of an indexing table 3. The table is raised
to bring the cap 1 into contact with a template 4, which has a plurality of openings
6 therein, corresponding in size and location to the size and location of the pads
of compound which are to be placed in cap 1. The table continues to rise,
carrying template 4, until the template comes in contact with a dispenser nozzle 5. A predetermined amount of compound is dispensed from nozzle 5 onto the
inner surface of cap 1, the locations and thickness of the pad of compound being
determined by the template 4. Table 3 then descends, moves laterally to the
next predetermined location, and starts to rise again to begin another dispensing
cycle. This operation continues for as many times as necessary to complete the
deposition of the specific number of pads required to be deposited in the cap 1.
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