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Via Communication Between Layers Of Printed Circuitry Utilizing Polyimide As A Dielectric

IP.com Disclosure Number: IPCOM000053402D
Original Publication Date: 1980-Jan-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Bakos, P Darrow, RE Franchak, NP Rasile, J [+details]

Abstract

Methods are shown and described wherein light-sensitive photoresists are applied as an auxiliary media for uniform via hole preparation. The methods relate to the fact that a required dielectric insulator is placed between at least two layers of personalized circuitry. With such structure, it is necessary to communicate between the circuitry on the two surfaces by means of conductors in via holes. These two methods are proposed as means to provide the best via holes, which, after further metallization, will result in the necessary communication between the circuitized personality.