Dual Sensing Method for TCM Protection
Original Publication Date: 1981-Oct-01
Included in the Prior Art Database: 2005-Feb-12
U.S. Patent 3,993,123 describes a thermal conduction module (TCM) which is partially illustrated in the drawing. The TCM includes a plurality of semiconductor devices or chips 1 mounted on a substrate 2 and connected to a multiplicity of conducting pins 3. A plurality of pistons 4 each contact a different one of chips 1 through the base of a spring 5. The pistons 4 and springs 5 are located in blind holes in a hat 6. In a completely assembled TCM, such as shown in the patent, a gas of high thermal conductivity, such as helium, is encapsulated in the TMM and the various chips are cooled by conduction through the piston, hat and gas. Additional cooling, such as provided by a water-cooled plate, carries heat away from the TCM.