Browse Prior Art Database

Flip Chip Heat Sink

IP.com Disclosure Number: IPCOM000053656D
Original Publication Date: 1981-Oct-01
Included in the Prior Art Database: 2005-Feb-12

Publishing Venue

IBM

Related People

Authors:
Bauman, AH Peterson, DG [+details]

Abstract

A technique is described for conducting away heat that is generated by flip chips.