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Method of Controlling Film Sheet Resistance and Temperature Coefficient of Resistance Disclosure Number: IPCOM000053665D
Original Publication Date: 1981-Oct-01
Included in the Prior Art Database: 2005-Feb-12

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Smith, PH [+details]


A technique is disclosed wherein key properties, sheet resistance and temperature coefficient of resistance, of deposited films, e.g., resistive films deposited on semiconductor wafers, are monitored in real time during material deposition to permit adjustment of sputtering or evaporation system parameters to reduce process variability through feedback and control.